TPS51200 LAYOUT(ARTWORK)

10 Layout

10.1 Layout Guidelines

Consider the following points before starting the TPS51200 device layout design.

• Place the input capacitors as close to VDLOIN pin as possible with short and wide connection.

• Place the output capacitor as close to VO pin as possible with short and wide connection. Place a ceramic

capacitor with a value of at least 10-μF as close to VO pin if the rest of output capacitors need to be placed

on the load side.

• Connect the VOSNS pin to the positive node of output capacitors as a separate trace. In DDR VTT

application, connect the VO sense trace to DIMM side to ensure the VTT voltage at DIMM side is well

regulated.

• Consider adding low-pass filter at VOSNS if the VO sense trace is very long.

• Connect the GND pin and PGND pin to the thermal pad directly.

• TPS51200 uses its thermal pad to dissipate heat. In order to effectively remove heat fromTPS51200 package,

place numerous ground vias on the thermal pad. Use large ground copper plane, especially the copper plane

on surface layer, to pour over those vias on thermal pad.

• Consult the TPS51200EVM User's Guide (SLUU323) for detailed layout recommendations.